時事英豪｜看新聞學英文《港AI產業專利穩步增長　聚才量論文份額均飆升》

【編者按】為回應家長和學生對提升英文能力的需求，點教育推出欄目「時事英豪」。本欄目精選社會熱點，以中英對照形式解構新聞時事，並提煉實用英文詞彙，文末更設有思考題，助學生在了解時事的同時鍛煉語言能力。

新時代的香港，在人工智能領域也不甘落後。

內容如下：

香港特區政府持續加大力度，推動人工智能（AI）作為未來發展的核心產業，成果逐漸展現。

The Hong Kong SAR Government has been continuously intensifying its efforts to promote artificial intelligence (AI) as a core industry for future development, with results gradually emerging.

立法會秘書處資料研究組最新發布《數據透視》，顯示香港在2025年的人工智能專業人員淨流入幅度、佔全球高影響力人工智能學術論文的份額均錄得明顯增幅，香港的專利申請密集度亦見穩步增長。

The latest "Statistical Highlights" publication released by the Research Office of the Legislative Council Secretariat shows that in 2025, Hong Kong recorded significant increases in both the net inflow rate of AI professionals and its share of global high-impact AI academic papers, while the density of Hong Kong's patent applications has also seen steady growth.

學術論文數據是衡量人工智能研究成果的指標之一。《數據透視》引述經合組織的數據顯示，香港佔全球高影響力人工智能學術論文的份額，由2018年0.79%的較低基數，升至2025年的1.48%，增加0.69個百分點，增幅達87.3%。

Academic paper data is one of the indicators for measuring AI research output. Citing OECD data, "Statistical Highlights" shows that Hong Kong's share of global high-impact AI academic papers rose from a relatively low base of 0.79% in 2018 to 1.48% in 2025, an increase of 0.69 percentage points, or 87.3%.

至2025年，香港的全球份額超越新加坡，後者的份額由2018年的1.32%降至2025年的1.13%，跌幅為14.4%。同期，美國及歐盟的份額分別下跌47.3%及28.3%，內地則上升85.1%。

By 2025, Hong Kong's global share surpassed that of Singapore, whose share fell from 1.32% in 2018 to 1.13% in 2025, a decline of 14.4%. Over the same period, the shares of the United States and the European Union fell by 47.3% and 28.3%, respectively, while the mainland's share rose by 85.1%.

專利數據是衡量人工智能相關創新的另一指標。按發明者所在地計算，2024年香港根據《專利合作條約》提交的專利申請中，人工智能相關專利申請佔8.5%，高於2018年的4.9%。雖然相關佔比仍低於新加坡（12.4%）及美國（9.4%），但香港的佔比在此期間一直高於全球水平，加上近年政府正致力加快研發成果商品化，截至今年9月，「產學研1+計劃」已有73個項目獲批，政府亦設100億港元的「創科產業引導基金」，引導市場資金投入指定產業，包括人工智能及機器人，該基金預計今年年底前推出。

Patent data is another indicator for measuring AI-related innovation. Calculated by the location of inventors, AI-related patent applications accounted for 8.5% of Hong Kong's patent applications filed under the Patent Cooperation Treaty in 2024, up from 4.9% in 2018. Although the relevant share remains lower than that of Singapore (12.4%) and the United States (9.4%), Hong Kong's share has consistently been above the global level during this period.

In addition, the Government has in recent years been committed to accelerating the commercialization of R&D outcomes. As of September 2026, 73 projects had been approved under the "Research, Academic and Industry Sectors One-plus Scheme" (RAISe+ Scheme). The Government has also established a HK$10 billion "Innovation and Technology Industry-Oriented Fund" to guide market capital into designated industries, including AI and robotics. The fund is expected to be launched before the end of this year.

另一方面，香港特區政府近年推出了一系列招攬全球人才的措施。經合組織數據顯示，以每萬名領英（LinkedIn）會員計算，香港人工智能專業人員由2022年淨流出0.66名，扭轉為2025年淨流入1.76名。淨流入幅度高於新加坡（0.90）、美國（0.92）及經合組織平均水平（0.47）。

On the other hand, the Hong Kong SAR Government has introduced a series of measures in recent years to attract global talent. OECD data shows that, calculated per 10,000 LinkedIn members, Hong Kong's AI professionals shifted from a net outflow of 0.66 in 2022 to a net inflow of 1.76 in 2025. The net inflow is higher than that of Singapore (0.90), the United States (0.92), and the OECD average (0.47).

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